Photonic curing is the high-temperature thermal processing of a thin film using pulsed light from a flashlamp.K. A. Schroder, Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Trade Show, 2, 220-223, 2011. When this transient processing is done on a low-temperature substrate such as plastic or paper, it is possible to attain a significantly higher temperature than the substrate can ordinarily withstand under an equilibrium heating source such as an oven. Since the rate of most thermal curing processes (drying, sintering, reacting, annealing, etc.) generally increase exponentially with temperature (i.e. they obey the Arrhenius equation), this process allows materials to be cured much more rapidly than with an oven.K. A. Schroder, S. C. McCool, W. R. Furlan, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, 3, 198-201, 2006.
It has become a transformative process used in the manufacture of printed electronics as it allows inexpensive and flexible substrates to be substituted for traditional glass or ceramic substrates. Additionally, the higher temperature processing afforded by photonic curing reduces the processing time exponentially, often from minutes down to milliseconds, which increases throughput all while maintaining a small machine footprint.
For most applications of photonic curing, designers consider a layered stack of materials. The goal of a curing profile design is to reach sufficient temperature to cause sintering and Metallizing of a top layer or print, while avoiding exceeding the glass transition temperature, melting point, or flash point of the layers beneath. The transient state thermal process of dissipating the heat delivered by the flashlamp depends, again, on the convective thermal losses from the top and bottom layers of the material of interest, and on the thickness of each layer. For thick layers or layers with low thermal conductivity, heat can be dissipated before the temperature of lower layers in the stack can exceed a glass transition or melting temperature. This is the key feature of photonic curing that allows for the curing of metals and conductive inks and paste on low temperature materials.
The maturing complexity of modern printed electronics for customer applications demands high throughput manufacturing and improved device function. The functionality of the printed electronics is critically important as customers demand more out of each device. Multiple layers are designed into each device, requiring ever more versatile processing techniques. Photonic curing is uniquely suited to complement the processing needs in the manufacture of modern printed electronics by providing a fast, reliable and transformative processing step. Photonic curing enables a lower thermal processing budget with current materials, and it can provide a path to incorporate more advanced materials and functionality into future printed electronics.
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